On the 23-24 May @PASSIONeuH2020 project will be at EPIC Meeting on “Automation Tools for Packaging and Testing”, hosted in Regensburg, Germany at ASM AMICRA
Giovanni Delrosso (VTT) will discuss wafer level packaging and hybrid integration in SiP .
#photonics @Photonics21 @PhotonicsEU #H2020 @EU_H2020 #PASSION4photonics