{"id":944,"date":"2019-05-22T09:09:24","date_gmt":"2019-05-22T09:09:24","guid":{"rendered":"http:\/\/www.passion-project.eu\/?post_type=news&#038;p=944"},"modified":"2023-09-07T06:31:00","modified_gmt":"2023-09-07T06:31:00","slug":"passion-at-epic-meeting-on-automation-tools-for-packaging-and-testing","status":"publish","type":"news","link":"https:\/\/www.passion-project.eu\/news\/passion-at-epic-meeting-on-automation-tools-for-packaging-and-testing\/","title":{"rendered":"PASSION at EPIC Meeting on Automation Tools for Packaging and Testing"},"content":{"rendered":"<div class=\"entry-content\">\n<p>On the 23-24 May @PASSIONeuH2020 project will be at <a href=\"https:\/\/www.epic-assoc.com\/epic-meeting-on-automation-tools-for-packaging-and-testing-at-amicra\/\" target=\"_blank\" rel=\"noopener\">EPIC Meeting on \u201cAutomation Tools for Packaging and Testing\u201d<\/a>, hosted in Regensburg, Germany at ASM AMICRA<\/p>\n<p><a href=\"https:\/\/www.passion-project.eu\/wp-content\/uploads\/2019\/05\/epic2.png\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-medium wp-image-945\" src=\"https:\/\/www.passion-project.eu\/wp-content\/uploads\/2019\/05\/epic2-300x223.png\" alt=\"\" width=\"300\" height=\"223\" srcset=\"https:\/\/www.passion-project.eu\/wp-content\/uploads\/2019\/05\/epic2-300x223.png 300w, https:\/\/www.passion-project.eu\/wp-content\/uploads\/2019\/05\/epic2-768x571.png 768w, https:\/\/www.passion-project.eu\/wp-content\/uploads\/2019\/05\/epic2-1024x762.png 1024w, https:\/\/www.passion-project.eu\/wp-content\/uploads\/2019\/05\/epic2.png 1081w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/a><\/p>\n<p>Giovanni Delrosso (VTT) will discuss wafer level packaging and hybrid integration in SiP .<br \/>\n#photonics @Photonics21 @PhotonicsEU #H2020 @EU_H2020 #PASSION4photonics<\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>On the 23-24 May @PASSIONeuH2020 project will be at EPIC Meeting on \u201cAutomation Tools for Packaging and Testing\u201d, hosted in Regensburg, Germany at ASM AMICRA Giovanni Delrosso (VTT) will discuss wafer level packaging and hybrid integration in SiP . #photonics @Photonics21 @PhotonicsEU #H2020 @EU_H2020 #PASSION4photonics<\/p>\n","protected":false},"author":9,"featured_media":0,"comment_status":"closed","ping_status":"closed","template":"","tags":[],"news-category":[7,4],"_links":{"self":[{"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/news\/944"}],"collection":[{"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/types\/news"}],"author":[{"embeddable":true,"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/comments?post=944"}],"version-history":[{"count":1,"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/news\/944\/revisions"}],"predecessor-version":[{"id":1276,"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/news\/944\/revisions\/1276"}],"wp:attachment":[{"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/media?parent=944"}],"wp:term":[{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/tags?post=944"},{"taxonomy":"news-category","embeddable":true,"href":"https:\/\/www.passion-project.eu\/wp-json\/wp\/v2\/news-category?post=944"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}